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晶振的发展趋势
2016年04月07日
一:小型化、片式化.
为了满足移动电话为代表的便携式产品的薄、短小、轻的要求,石英晶体振荡器已经在向陶瓷封装转变.采用贴片封装的TCXO的晶振也不断地朝小型化发展。包括行动电话的使用,以及数码相机、平板电脑使用的贴片石英晶振等。因此轻薄短小的竞争也因此逐渐呈现白热化.
二:低噪声化、高频化.
在GPS通信系统中是不允许频率颤抖的,而相位噪声是保证振荡器频率颤抖的一个重要参数,TCXO和OCXO的相位噪声性能近年来有了很大提高,100MHz OCXO相位噪声已经可以非常接近-180dBc/Hz@100KHz
三:高稳定度和高精度化.
TCXO已经有了0.07ppm的产品,OCXO的精度甚至能够达到0.2ppb。
四:硅晶振
硅晶振的出现大大加强了晶振的一致性降低了产品成本,缩短了供货周期,是将来发展的一个方向。

I: miniaturization, chip-based.
In order to meet the mobile phone as the representative of portable products, short, light requirements, quartz crystal oscillators have been converted to a ceramic package.SMD package TCXO crystal are constantly converted to miniaturization. Including mobile phone use, as well as digital cameras, Tablet PC chip quartz crystal and so on. So slim and light are gradually showing intense competition.
II: low noise, high frequency.
Tremble is not allowed in the GPS frequency communication system , and the phase noise is an important parameter to ensure oscillator frequency shaking, TCXO and OCXO’s phase noise performance has been greatly improved in recent years, 100MHz OCXO phase noise can be nearly close to the - 180dBc / Hz @ 100KHz
III: high stability and high precision.
TCXO products have reached 0.07ppm’s precision OCXO can even reach 0.2ppb.
IV: Silicon Crystal
Silicon crystal oscillator has significantly strengthened the consistency and reduced product costs, shorten lead times will be a direction in the future development.



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